HPND-4028, hpnd-4038 beam lead pin diodes for phased arrays and switches data sheet description the HPND-4028 and 4038 beam lead pin diodes are designed for low capacitance, low resistance, and fast switc h ing at microwave frequencies. these character - istics are achieved at low bias levels for minimal power consumption. advanced processing techniques ensure uniform and consistent electrical performance, allowing guaranteed capacitance windows. this translates to improved performance in phased array applications. rugged construction and strong beams ensure high assembly yields while nitride passivation and polyimide coating ensure reliability. applications these beam lead pin diodes are designed for use in stripline, coplanar waveguide, or micr o strip circuits. ap - plications include phase shifting and switching. the guaranteed capacitance windows ensure uniform per - formance in phased array radar. the low capac i tance makes them ideal for circuits requiring high isolation in the series confgur a tion. these devices have been fully chara c terized and s-parameters have been provided. maximum ratings operating temperature -65c to +150c storage temperature -65c to +200c power dissipation at t case = 25c (derate linearly to zero at 150c.) 250 mw minimum lead strength 4 grams pull on either lead per mil-s-19500, ltpd = 20 features ? low capacitance 0.025 pf maximum at 1 mhz guaranteed min./max. ? fast switching 2.0 nsec ? low resistance at low bias 1.5 f at if = 10 ma (typical) ? rugged construction typical 10 gram lead pull ? silicon nitride passivation outline 83 280 (11) 240 (9) 110 (4.5) 90 (3.5) 60 (2.4) 40 (1.6) 8 (0.3) min. dimensions in m (1/1000 inch) 690 (27) 650 (26) 330 (13) 260 (10) 220 (9) 180 (7) 180 (7) 160 (6)
2 electrical specifcations at ta = 25c part number capacitance (pf) series resistance r s (?) break-down voltage v br (v) reverse current i r (na) forward voltage v f (v) carrier lifetime (ns) reverse recovery trr (ns) series resistance r s (?) hpnd- min. max. typ. max. min. max. max. typ. typ. typ. 4028 0.025 0.045 2.3 3.0 60 100 1.1 36 2.6 2.0 4038 0.045 0.065 1.5 2.0 60 100 1.1 45 2.4 1.0 test conditions v r = 30 v f = 1 mhz i f = 10 ma f = 100 mhz v r = v br measure i r 10 ma v r = 50 v i f = 20 ma i f = 10 ma i r = 6 ma *i f = 10 ma i f = 5 ma v r = 10 v i f = 50 ma f = 100 mhz 90% recovery typical parameters frequency (ghz) figure 1. typical isolation and insertion loss, HPND-4028. isolation (db) frequency (ghz) figure 2. typical isolation and insertion loss, hpnd-4038. isolation (db) insertion loss (db) - 3 0 v 0 v 1 ma 5 ma 10 ma 0.12 0.06 0.08 0.10 0.04 0.02 0 0 1 0 2 0 3 0 capacitance (pf) reverse voltage (v) figure 3. typical capacitance vs. reverse voltage (at 1 mhz). 40 15 20 25 30 35 10 5 0 0 0.15 0.30 0.45 0.60 0.75 1 1 0 1 8 2 0 - 3 0 v 0 v 1 ma 5 ma 10 ma 30 10 14 18 22 26 6 2 1 1 0 2 0 100 insertion loss (db) 0 0.1 0.2 0.3 0.4 0.5 HPND-4028 hpnd-4038 12 6 8 10 4 2 0 0 5 10 15 reverse recovery time (nsec) forward current (ma) figure 4. typical reverse recovery time vs. forward current (series configuration). HPND-4028, hpnd- 4038. v n = 10 v v n = 20v figure 5. typical forward characteristics. forward voltage (v) 100 10 1 0.1 0.01 0.001 forward current (ma) 0 0.2 0.4 0.6 0.8 1.0 i f - forward bias current (ma) figure 6. typical rf resistance vs. forward bias current (at 100 mhz). 1000 100 10 1.0 0.1 rf resistance (ohms) 0.01 0.10 1.0 10 100 hpnd-4038 HPND-4028
3 typical s-parameters (in series confguration) at z o = 50 ?, 25c HPND-4028 freq. i f = 1 ma i f = 5 ma i f = 10 ma s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.046 7 -0.38 0.958 -1 0.031 17 -0.24 0.973 -1 0.027 19 -0.20 0.978 -1 2000 0.048 20 -0.40 0.956 -2 0.036 33 -0.26 0.971 -2 0.033 37 -0.22 0.975 -2 3000 0.052 29 -0.40 0.957 -4 0.041 43 -0.26 0.972 -4 0.040 47 -0.22 0.975 -4 4000 0.058 36 -0.40 0.957 -5 0.049 49 -0.26 0.971 -5 0.047 53 -0.22 0.975 -5 5000 0.063 42 -0.40 0.956 -6 0.057 54 -0.26 0.971 -6 0.055 58 -0.22 0.975 -6 6000 0.069 46 -0.40 0.956 -7 0.064 57 -0.26 0.971 -7 0.063 60 -0.24 0.974 -7 7000 0.075 48 -0.40 0.956 -8 0.070 60 -0.26 0.971 -8 0.070 62 -0.22 0.975 -8 8000 0.081 50 -0.40 0.955 -9 0.077 60 -0.28 0.970 -9 0.076 63 -0.24 0.974 -9 9000 0.087 51 -0.40 0.956 -11 0.084 61 -0.28 0.970 -11 0.083 63 -0.24 0.974 -11 10000 0.092 52 -0.40 0.956 -12 0.089 61 -0.28 0.970 -12 0.089 63 -0.24 0.974 -12 11000 0.097 53 -0.40 0.956 -13 0.095 61 -0.26 0.971 -13 0.095 63 -0.22 0.975 -13 12000 0.103 52 -0.40 0.956 -14 0.101 60 -0.26 0.971 -14 0.101 62 -0.22 0.975 -14 13000 0.107 51 -0.40 0.957 -15 0.106 59 -0.26 0.971 -15 0.105 62 -0.22 0.975 -15 14000 0.112 51 -0.42 0.954 -17 0.110 59 -0.30 0.968 -17 0.111 61 -0.24 0.973 -17 15000 0.119 51 -0.42 0.953 -18 0.117 58 -0.28 0.969 -18 0.117 60 -0.26 0.972 -18 16000 0.123 51 -0.44 0.952 -19 0.122 57 -0.28 0.969 -19 0.123 60 -0.26 0.972 -19 17000 0.129 49 -0.44 0.952 -20 0.130 56 -0.30 0.967 -20 0.129 57 -0.26 0.971 -20 18000 0.139 48 -0.46 0.950 -22 0.139 55 -0.32 0.965 -21 0.140 56 -0.28 0.970 -22 HPND-4028 freq. v r = 0 v v r = 10 v v r = 30 v s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.997 -4 -27.54 0.042 86 0.999 -3 -33.16 0.022 91 1.000 -2 -33.98 0.020 91 2000 0.988 -7 -21.74 0.082 79 0.997 -6 -27.34 0.043 86 0.998 -5 -28.18 0.039 86 3000 0.974 -11 -18.36 0.121 74 0.994 -8 -23.62 0.066 83 0.996 -7 -24.44 0.060 84 4000 0.958 -14 -16.10 0.157 69 0.991 -10 -21.12 0.088 81 0.992 -10 -21.94 0.080 82 5000 0.940 -17 -14.48 0.189 64 0.986 -13 -19.26 0.109 78 0.987 -13 -20.10 0.099 79 6000 0.921 -21 -13.20 0.219 70 0.979 -16 -17.66 0.131 75 0.982 -15 -18.42 0.120 76 7000 0.898 -24 -12.16 0.247 56 0.972 -19 -16.26 0.054 72 0.976 -18 -17.08 0.140 73 8000 0.879 -26 -11.36 0.271 52 0.965 -21 -15.20 0.174 70 0.970 -21 -15.92 0.160 71 9000 0.857 -29 -10.64 0.294 48 0.954 -24 -14.20 0.195 67 0.960 -23 -14.96 0.179 68 10000 0.836 -32 -10.12 0.312 46 0.942 -27 -13.44 0.213 65 0.950 -26 -14.20 0.195 66 11000 0.816 -35 -9.54 0.334 42 0.931 -30 -12.58 0.235 61 0.937 -29 -13.32 0.216 62 12000 0.795 -37 -9.10 0.351 40 0.917 -33 -11.84 0.256 59 0.926 -32 -12.62 0.234 60 13000 0.778 -40 -8.86 0.361 37 0.904 -36 -11.44 0.268 56 0.913 -34 -12.20 0.246 57 14000 0.761 -42 -8.44 0.379 33 0.892 -38 -10.80 0.289 52 0.903 -37 -11.52 0.266 54 15000 0.744 -44 -8.34 0.383 31 0.876 -41 -10.56 0.297 50 0.888 -39 -11.26 0.274 52 16000 0.733 -46 -8.04 0.397 28 0.867 -43 -10.12 0.312 46 0.881 -42 -10.80 0.289 48 17000 0.720 -48 -7.94 0.401 26 0.855 -45 -9.96 0.318 44 0.869 -44 -10.64 0.294 46 18000 0.709 -50 -8.00 0.399 24 0.846 -47 -9.94 0.319 42 0.861 -46 -10.64 0.294 44
4 typical s-parameters (in series confguration) at z o = 50 ?, 25c (cont.) hpnd-4038 freq. i f = 1 ma i f = 5 ma i f = 10 ma s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.028 15 -0.22 0.976 -1 0.019 28 -0.12 0.987 -1 0.017 35 -0.10 0.989 -1 2000 0.032 34 -0.24 0.974 -2 0.026 50 -0.16 0.984 -2 0.024 56 -0.14 0.986 -2 3000 0.037 47 -0.22 0.975 -3 0.034 61 -0.14 0.985 -3 0.033 66 -0.12 0.988 -4 4000 0.045 55 -0.22 0.975 -5 0.042 67 -0.14 0.985 -5 0.042 70 -0.12 0.987 -5 5000 0.052 61 -0.24 0.974 -6 0.051 72 -0.16 0.984 -6 0.051 75 -0.14 0.986 -6 6000 0.060 65 -0.24 0.974 -7 0.059 74 -0.16 0.984 -7 0.059 77 -0.14 0.986 -7 7000 0.067 67 -0.24 0.974 -8 0.067 76 -0.16 0.984 -8 0.067 78 -0.12 0.987 -8 8000 0.073 69 -0.24 0.974 -9 0.074 76 -0.16 0.983 -9 0.073 78 -0.14 0.986 -9 9000 0.081 70 -0.24 0.973 -10 0.081 77 -0.16 0.984 -10 0.081 78 -0.14 0.986 -10 10000 0.087 71 -0.24 0.974 -11 0.088 77 -0.16 0.982 -11 0.089 79 -0.14 0.986 -11 11000 0.092 71 -0.22 0.975 -12 0.094 77 -0.16 0.984 -12 0.094 79 -0.14 0.986 -12 12000 0.099 70 -0.24 0.974 -14 0.100 76 -0.16 0.984 -14 0.101 77 -0.14 0.986 -14 13000 0.104 70 -0.22 0.975 -15 0.106 75 -0.14 0.985 -15 0.107 76 -0.12 0.987 -15 14000 0.110 69 -0.26 0.972 -16 0.112 74 -0.16 0.982 -16 0.113 75 -0.16 0.984 -16 15000 0.118 67 -0.24 0.973 -17 0.119 72 -0.16 0.983 -17 0.120 73 -0.14 0.985 -17 16000 0.123 66 -0.24 0.973 -18 0.125 71 -0.16 0.982 -18 0.126 72 -0.16 0.984 -18 17000 0.132 64 -0.26 0.972 -19 0.133 68 -0.16 0.982 -19 0.133 69 -0.16 0.984 -19 18000 0.141 62 -0.26 0.972 -20 0.143 66 -0.18 0.980 -20 0.143 67 -0.16 0.983 -20 hpnd-4038 freq. v r = 0 v v r = 10 v v r = 30 v s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 /s 12 s 11 /s 22 s 21 / s 12 (mhz) mag. ang. db mag. ang. mag. ang. db mag. ang. mag. ang. db mag. ang. 1000 0.993 -5 -23.10 0.070 83 0.998 -3 -28.88 0.036 89 0.999 -3 -29.90 0.032 90 2000 0.976 -10 -17.28 0.137 76 0.995 -7 -22.86 0.072 84 0.996 -6 -23.76 0.065 85 3000 0.953 -15 -14.04 0.199 70 0.990 -10 -19.26 0.109 81 0.992 -9 -20.18 0.098 82 4000 0.923 -19 -11.88 0.255 64 0.982 -13 -16.78 0.145 78 0.986 -12 -17.74 0.130 79 5000 0.890 -23 -10.36 0.304 58 0.973 -16 -14.90 0.180 74 0.977 -15 -15.88 0.161 75 6000 0.857 -27 -9.20 0.347 53 0.962 -20 -13.40 0.214 71 0.968 -19 -14.30 0.193 73 7000 0.822 -31 -8.28 0.386 49 0.947 -23 -12.08 0.249 68 0.956 -22 -12.96 0.225 69 8000 0.790 -34 -7.58 0.418 45 0.933 -27 -11.06 0.280 65 0.945 -25 -11.92 0.254 66 9000 0.757 -38 -7.00 0.447 41 0.915 -30 -10.12 0.312 61 0.928 -29 -10.94 0.284 63 10000 0.727 -41 -6.54 0.471 38 0.897 -34 -9.40 0.339 58 0.912 -32 -10.22 0.309 61 11000 0.697 -44 -6.10 0.496 34 0.877 -37 -8.62 0.371 54 0.892 -35 -9.44 0.338 57 12000 0.668 -46 -5.74 0.517 32 0.854 -41 -8.00 0.399 52 0.874 -38 -8.76 0.365 54 13000 0.643 -49 -5.56 0.528 29 0.834 -44 -7.60 0.417 49 0.854 -42 -8.34 0.383 51 14000 0.620 -51 -5.22 0.549 26 0.813 -47 -7.04 0.445 45 0.839 -45 -7.76 0.410 48 15000 0.599 -53 -5.16 0.553 24 0.793 -50 -6.82 0.457 43 0.818 -48 -7.50 0.422 45 16000 0.584 -55 -4.90 0.569 21 0.778 -53 -6.42 0.478 39 0.805 -50 -7.10 0.442 42 17000 0.570 -57 -4.80 0.576 19 0.762 -55 -6.22 0.489 37 0.790 -53 -6.88 0.453 40 18000 0.556 -59 -4.84 0.574 17 0.747 -58 -6.18 0.491 35 0.776 -55 -6.86 0.454 37
5 bonding and handling procedures for beam lead diodes 1. storage under normal circumstances, storage of beam lead diodes in avago supplied wafe/gel packs is sufcient. in particularly dusty or chemically hazardous environ - ments, storage in an inert atmosphere desiccator is advised. 2. handling in order to avoid damage to beam lead devices, par - ticular care must be exercised during inspection, testing, and assembly. although the beam lead diode is designed to have exceptional lead strength, its small size and delicate nature requires that special handling techniques be observed so that the devices will not be mechanically or electrically damaged. a vacuum pickup is recommended for picking up beam lead devices, par - ticularly larger ones, e.g., quads. care must be exercised to assure that the vacuum opening of the needle is suf - fciently small to avoid passage of the device through the opening. a #27 tip is recommended for picking up single beam lead devices. a 20x magnifcation is needed for precise positioning of the tip on the device. where a vacuum pickup is not used, a sharpened wooden q-tip dipped in isopropyl alcohol is very commonly used to handle beam lead devices. 3. cleaning for organic contamination use a warm rinse of trichlo - roethane, or its locally approved equivalent, followed by a cold rinse in acetone and methanol. dry under infrared heat lamp for 5C10 minutes on clean flter paper. freon degreaser, or its locally approved equivalent, may replace trichloroethane for light organic contamination. ? ultrasonic cleaning is not recommended. ? acid solvents should not be used. 4. bonding thermocompression: see application note 979 the handling and bonding of beam lead devices made easy. this method is good for hard substrates only. wobble: this method picks up the device, places it on the substrate and forms a thermo-compression bond all in one operation. this is described in the latest version of mil-std-883, method 2017, and is intended for hard substrates only. resistance welding or parallel-gap welding: to make welding on soft substrates easier, a low pressure welding head is recommended. suitable equipment is available from hughes, industrial products division in carlsbad, ca. epoxy: with solvent free, low resistivity epoxies (available from ablestik and improvements in dispens - ing equipment, the quality of epoxy bonds is sufcient for many applications. 5. lead stress in the process of bonding a beam lead diode, a certain amount of bugging occurs. the term bugging refers to the chip lifting away from the substrate during the bonding process due to the deformation of the beam by the bonding tool. this efect is benefcial as it provides stress relief for the diode during thermal cycling of the substrate. the coefcient of expansion of some substrate materials, specifcally soft substrates, is such that some bugging is essential if the circuit is to be operated over wide temperature extremes. thick metal clad ground planes restrict the thermal expansion of the dielectric substrates in the x-y axis. the expansion of the dielectric will then be mainly in the z axis, which does not afect the beam lead device. an alternate solution to the problem of dielec - tric ground plane expansion is to heat the substrate to the maximum required operating temperature during the beam lead attachment. thus, the substrate is at maximum expansion when the device is bonded. sub - sequent cooling of the substrate will cause bugging, similar to bugging in thermocompression bonding or epoxy bonding. other methods of bugging are pre - forming the leads during assembly or prestressing the substrate.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5967-6157e av01-0594en - october 20, 2006
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